74LVC1G157GV-Q100H - Nexperia

74LVC1G157GV-Q100H Details

• Manufacturer Part Number:

  74LVC1G157GV-Q100H

• Brand Name:

  Nexperia

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  TSOP

• Package Description:

  TSOP-6

• Pin Count:

  6

• Manufacturer Package Code:

  SOT457

• HTS Code:

  8542.39.00.60

• Factory Lead Time:

  12 Weeks

• Manufacturer:

  Nexperia

• YTEOL:

  6.4

• Family:

  LVC/LCX/Z

• JESD-30 Code:

  R-PDSO-G6

• Length:

  2.9 mm

• Load Capacitance (CL):

  50 pF

• Logic IC Type:

  MULTIPLEXER

• Max I(ol):

  0.032 A

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Inputs:

  2

• Number of Outputs:

  1

• Number of Terminals:

  6

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Output Polarity:

  TRUE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSOP6,.11,37

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Packing Method:

  TR, 7 INCH

• Peak Reflow Temperature (Cel):

  260

• Power Supply Current-Max (ICC):

  0.04 mA

• Prop. Delay@Nom-Sup:

  6.3 ns

• Propagation Delay (tpd):

  13 ns

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  1.1 mm

• Supply Voltage-Max (Vsup):

  5.5 V

• Supply Voltage-Min (Vsup):

  1.65 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.95 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1.5 mm