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74LVCH16373APAG - Renesas Electronics

Description: The 74LVCH16373A 16-bit transparent high-speed, low-power D-type latch is ideal for temporary storage of data. The 74LVCH16373A can be used for implementing memory address latches, I/O ports, and bus drivers. All pins of the 74LVCH16373A can be driven from either 3.3V or 5V devices which allows the use of the device as a translator in a mixed 3.3V/5V supply system. The LVCH16373A has "bus-hold" which prevents floating inputs and eliminates the need for pull-up/down resistors. The 74LVCH16373A operates at -

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PCB Footprints
74LVCH16373APAG - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG48
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74LVCH16373APAG - Renesas Electronics  - 3D model - Small Outline Packages - PAG48
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74LVCH16373APAG Details

  • Manufacturer Part Number:

    74LVCH16373APAG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    PAG48

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    12.5 mm

  • Load Capacitance (CL):

    30 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    4.6 ns

  • Propagation Delay (tpd):

    5.3 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    6.1 mm

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74LVCH16373APAG Overview

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