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7UL1G32FU,LF - Toshiba

Description: Logic Gates LVP GATE OR VCC: 0.9-3.6V

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7UL1G32FU,LF - Toshiba - PCB symbol
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PCB Footprints
7UL1G32FU,LF - Toshiba PCB footprint - Other - Other - USV
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3D Models
7UL1G32FU,LF - Toshiba - 3D model - Other - USV
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7UL1G32FU,LF Details

  • Manufacturer Part Number:

    7UL1G32FU,LF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ,

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Family:

    AUP/ULP/V

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2 mm

  • Load Capacitance (CL):

    30 pF

  • Logic IC Type:

    OR GATE

  • Max I(ol):

    0.008 A

  • Number of Functions:

    1

  • Number of Inputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Power Supply Current-Max (ICC):

    0.08 mA

  • Prop. Delay@Nom-Sup:

    5.2 ns

  • Propagation Delay (tpd):

    73.6 ns

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

7UL1G32FU,LF Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider derating the device's power dissipation according to the ambient temperature.
  • The 7UL1G32FU,LF has built-in ESD protection, but it's still essential to follow standard ESD handling precautions, such as using an anti-static wrist strap, anti-static bags, and a grounded workstation, to prevent damage during handling and assembly.
  • The 7UL1G32FU,LF is not specifically designed or tested for radiation-hardened applications. If you need a radiation-hardened device, please consult with Toshiba or a qualified radiation-hardened component supplier.
  • Toshiba recommends following the JEDEC J-STD-020 standard for soldering profiles, with a peak temperature of 260°C and a dwell time of 30-60 seconds. However, it's essential to consult the specific soldering guidelines provided by Toshiba or a qualified soldering expert.

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7UL1G32FU,LF Overview

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