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7WBD3306USG - onsemi

Description: High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V; 3 ohms Switch Connection Between 2 Ports; Power Down Protection Provided on Inputs; Zero Bounce; TTLCompatible Control Inputs; UltraSmall PbFree Packages; These are PbFree Devices

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7WBD3306USG Details

  • Manufacturer Part Number:

    7WBD3306USG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    US8

  • Package Description:

    US-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    493-01

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    3-STATE WITH SERIES RESISTOR

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    150 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    TTL

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    NICKEL GOLD PALLADIUM

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

7WBD3306USG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for good airflow.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a heat sink or thermal pad, and implement thermal management techniques such as reducing power consumption or using a fan.
  • The recommended soldering conditions for the 7WBD3306USG include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that follows the IPC J-STD-020 standard.
  • To handle ESD protection during handling and assembly, use an ESD wrist strap or mat, handle the device by the body or pins, avoid touching the pins or die, and store the device in an ESD-protective package.
  • Operating the device beyond the recommended voltage range can lead to reduced reliability, increased power consumption, and potentially even device failure. It's essential to follow the recommended voltage range to ensure reliable operation.

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