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7WBD383USG - onsemi

Description: High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V; 3 ohms Switch Connection Between 2 Ports; Power Down Protection Provided on Inputs; Zero Bounce; TTLCompatible Control Inputs; UltraSmall PbFree Packages; These are PbFree Devices

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PCB Footprints
7WBD383USG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - US8 CASE 493 ISSUE DUS8 US SUFFIX CASE 493−02 ISSUE D
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3D Models
7WBD383USG - onsemi  - 3D model - Small Outline Packages - US8 CASE 493 ISSUE DUS8 US SUFFIX CASE 493−02 ISSUE D
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7WBD383USG Details

  • Manufacturer Part Number:

    7WBD383USG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    US8

  • Package Description:

    US-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    493-01

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    150 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    TTL

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    NICKEL GOLD PALLADIUM

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

7WBD383USG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 10uF to 22uF values, and for output capacitors, use 10uF to 47uF values.
  • Use a shielded enclosure, keep sensitive components away from the 7WBD383USG, and use a common-mode choke or ferrite bead on the input lines. Ensure good PCB layout practices, such as separating analog and digital grounds.
  • Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.

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7WBD383USG Overview

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