The recommended PCB footprint for the 80CNQ035A is a standard TO-220 package with a minimum pad size of 4.5mm x 4.5mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux to the pins. Avoid applying excessive force or pressure during soldering, and ensure the component is properly aligned with the PCB pads.
The maximum allowed voltage derating for the 80CNQ035A is 10% of the maximum rated voltage (35V) at an ambient temperature of 150°C. This means the maximum allowed voltage derating is 3.5V.
While the 80CNQ035A is suitable for high-frequency switching applications, it's essential to consider the device's switching losses, which can be significant at high frequencies. Ensure proper thermal management and consider using a heat sink to prevent overheating.
To calculate the power dissipation of the 80CNQ035A, use the following formula: Pd = (Vds x Ids) + (Vgs x Igs), where Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current. Consult the datasheet for the device's thermal resistance and maximum junction temperature to ensure safe operation.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
80CNQ035A Overview
Use the download button to access the 80CNQ035A 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 80CNQ,
or try a keyword search, such as Rectifier Diodes
