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80SXV27MX - Panasonic

Description: PANASONIC - 80SXV27MX - CAP, 27UF, 80V, ALU ELEC, POLYMER, SMD

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PCB Footprints
80SXV27MX - Panasonic PCB footprint - Other - Other - F8
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3D Models
80SXV27MX - Panasonic  - 3D model - Other - F8
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80SXV27MX Details

  • Manufacturer Part Number:

    80SXV27MX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.20

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7.85

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ-300KHZ

  • Capacitance:

    27 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    10 mm

  • Dielectric Material:

    ALUMINUM (SOLID POLYMER)

  • ESR:

    55 mΩ

  • Height:

    7.9 mm

  • Leakage Current:

    0.108 mA

  • Length:

    10.3 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 15 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    80 V

  • Ripple Current:

    33 mA

  • Size Code:

    4141

  • Surface Mount:

    YES

  • Tan Delta:

    0.12

  • Terminal Shape:

    FLAT

  • Width:

    10.3 mm

80SXV27MX Frequently Asked Questions (FAQs)

  • Panasonic recommends a 4-layer PCB with a solid ground plane, and a separate power plane for the input and output. The input and output capacitors should be placed as close as possible to the pins, and the PCB should be designed to minimize parasitic inductance and capacitance.
  • To ensure reliable operation over the full temperature range, it's essential to follow proper thermal design and management practices. This includes providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, the device should be operated within the recommended voltage and current ratings.
  • The 80SXV27MX has built-in ESD protection, but it's still important to follow proper handling and storage precautions to prevent damage. This includes using anti-static wrist straps, mats, and bags, and avoiding direct contact with the device's pins. The device should be stored in a dry, cool place, away from direct sunlight and moisture.
  • The 80SXV27MX is designed to operate in a variety of environments, including those with high vibration. However, it's essential to ensure that the device is properly secured to the PCB and that the PCB is designed to withstand the expected vibration levels. Additionally, the device's pins should be properly soldered and secured to prevent damage.
  • Common issues with the 80SXV27MX include overheating, output voltage instability, and input voltage undershoot. To troubleshoot these issues, engineers should check the device's thermal design, input and output capacitor values, and the PCB layout. They should also verify that the device is operated within the recommended voltage and current ratings.

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80SXV27MX Overview

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