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830S21AMILF - Renesas Electronics

Description: 830S21I is a 1-to-1 Differential-to- LVCMOS/ LVTTL translator and a member of the family of High Performance Clock Solutions from IDT. The differential input is highly flexible and can accept the following input types: LVPECL, LVDS, LVHSTL, SSTL and HCSL. The small 8-lead SOIC footprint makes this device ideal for use in applications with limited board space.

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830S21AMILF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - DCG8
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830S21AMILF Details

  • Manufacturer Part Number:

    830S21AMILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    DCG8

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    830

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    2 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

830S21AMILF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application notes. Typically, the sequence involves powering up the VCC pin first, followed by the VDD pin, and then the other power pins.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 0.1uF to 1uF, placed as close as possible to the power pins. The specific capacitor values and placement can be found in the device's user manual or application notes.
  • Renesas provides guidelines for JTAG interface handling during production testing in their device-specific documentation. This includes information on JTAG pin connections, signal levels, and testing procedures to ensure reliable device programming and testing.
  • Renesas provides thermal design guidelines and thermal models for the 830S21AMILF in their documentation. Engineers should consider factors such as junction temperature, thermal resistance, and heat sink design to ensure reliable device operation in high-temperature environments.

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830S21AMILF Overview

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