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83940DYILFT - Renesas Electronics

Description: The 83940DI is a low skew, 1-to-18 LVPECL- to-LVCMOS/LVTTL Fanout Buffer. The 83940DI has two selectable clock inputs. The PCLK, nPCLK pair can accept LVPECL, CML, or SSTL input levels. The LVCMOS_CLK can accept LVCMOS or LVTTL input levels. The low impedance LVCMOS/LVTTL outputs are designed to drive 50Ω series or parallel terminated transmission lines. The 83940DI is characterized at full 3.3V and 2.5V or mixed 3.3V core, 2.5V output operating supply modes. Guaranteed output and part-to-part skew characte

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83940DYILFT - Renesas Electronics - PCB symbol
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83940DYILFT - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PRG32
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83940DYILFT - Renesas Electronics - 3D model - Quad Flat Packages - PRG32
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83940DYILFT Details

  • Manufacturer Part Number:

    83940DYILFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Package Description:

    LQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    PRG32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    83940

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.02 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    25 mA

  • Prop. Delay@Nom-Sup:

    3.8 ns

  • Propagation Delay (tpd):

    3.8 ns

  • Same Edge Skew-Max (tskwd):

    0.2 ns

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • fmax-Min:

    250 MHz

83940DYILFT Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-114) for thermal management. It suggests using a 4-layer PCB with a thermal pad connected to a solid ground plane, and placing thermal vias under the package to improve heat dissipation.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. The recommended sequence is: VCC, VCCIO, then VREF. A delay of at least 10ms is recommended between each power-up step. Refer to the datasheet and application notes for more details.
  • Although not explicitly stated in the datasheet, Renesas recommends keeping the capacitance on the VREF pin below 100nF to ensure stable operation. Excessive capacitance can cause oscillations and affect device performance.
  • While the datasheet specifies a maximum operating frequency, Renesas may provide additional information or guidance for operating the device at higher frequencies. It's recommended to contact Renesas support or consult their application notes for specific guidance on frequency derating and potential limitations.
  • Renesas recommends following standard ESD protection guidelines, including using ESD-sensitive handling procedures, implementing ESD protection circuits, and ensuring proper PCB design and layout to minimize ESD risks. Refer to the datasheet and application notes for more information.

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