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83948AYI-147LF - Renesas Electronics

Description: The 83948I-147 is a low skew, 1-to-12 Differential-to-LVCMOS/LVTTL Fanout Buffer. The 83948I-147 has two selectable clock inputs. The CLK, nCLK pair can accept most standard differential input levels. The LVCMOS_CLK can accept LVCMOS or LVTTL input levels. The low impedance LVCMOS/LVTTL outputs are designed to drive 50Ω series or parallel terminated transmission lines. The effective fanout can be increased from 12 to 24 by utilizing the ability of the outputs to drive two series terminated lines. The 83948I

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83948AYI-147LF - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PRG32
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83948AYI-147LF - Renesas Electronics  - 3D model - Quad Flat Packages - PRG32
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83948AYI-147LF Details

  • Manufacturer Part Number:

    83948AYI-147LF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Package Description:

    LQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    PRG32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • Additional Feature:

    ALSO OPERATE AT 3.3V SUPPLY

  • Family:

    83948

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    55 mA

  • Prop. Delay@Nom-Sup:

    4.4 ns

  • Propagation Delay (tpd):

    4.4 ns

  • Same Edge Skew-Max (tskwd):

    0.16 ns

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • fmax-Min:

    350 MHz

83948AYI-147LF Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation. A thermal pad on the bottom of the package should be connected to a solid ground plane or a thermal relief pattern.
  • Use a shielded enclosure, and ensure the PCB layout follows good EMC practices (e.g., separate analog and digital grounds, minimize loop areas, and use decoupling capacitors). Implement EMI filtering on I/O lines and consider using a common-mode choke on the power supply lines.
  • Power-up: Apply power to the device in the following sequence: VCC, AVCC, and then DVCC. Power-down: Reverse the sequence. Ensure a minimum of 10ms delay between power-up and power-down sequences to allow for internal voltage regulators to stabilize.
  • Use a latch-up prevention circuit or a power-on reset (POR) circuit to ensure the device is properly reset during power-up. Implement a voltage supervisor or a brown-out detector to detect and respond to voltage drops or power failures.
  • Store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the devices by the body, avoiding touching the pins or leads. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage.

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