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85108AGILF - Renesas Electronics

Description: The 85108I is a low skew, high performance 1-to-8 Differential-to-0.7V HCSL Clock Distribution Chip. The 85108I CLK, nCLK pair can accept most differential input levels and translates them to 3.3V HCSL output levels. The 85108I provides a low power, low noise, low skew, point-to-point solution for distributing HCSL clock signals. Guaranteed output and part-to-part skew specifications make the 85108I ideal for those applications demanding well defined performance and repeatability.

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85108AGILF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - (TSSOP)24
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85108AGILF - Renesas Electronics  - 3D model - Small Outline Packages - (TSSOP)24
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85108AGILF Details

  • Manufacturer Part Number:

    85108AGILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    PGG24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    85108

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    27 mA

  • Prop. Delay@Nom-Sup:

    3 ns

  • Propagation Delay (tpd):

    3 ns

  • Same Edge Skew-Max (tskwd):

    0.08 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    2.97 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • fmax-Min:

    500 MHz

85108AGILF Frequently Asked Questions (FAQs)

  • Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the power planes.
  • Use a common clock source and ensure signal integrity by using differential signaling, such as LVDS or RS-422, and implement error detection and correction mechanisms, like CRC or checksums.
  • Power up the core voltage (VCC) before the I/O voltage (VCCIO). Ensure a minimum of 10 ms delay between power-up and initialization to allow for internal voltage regulators to settle.
  • Use the 85108AGILF's power management features, such as dynamic voltage and frequency scaling, and implement power gating for unused peripherals. Optimize your firmware to minimize active modes and use low-power modes when possible.
  • Use a metal shield or enclosure to contain electromagnetic radiation. Ensure proper grounding and decoupling of the 85108AGILF and external components. Follow Renesas' guidelines for PCB layout and component placement to minimize emissions.

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