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8535AGI-21LFT - Renesas Electronics

Description: The 8535I-21 is a low skew, high performance 1-to-2 LVCMOS/LVTTL-to-3.3V LVPECL fanout buffer and a member of the HiPerClockS™ family of High Performance Clock Solutions from IDT. The 8535I-21 has two single-ended clock inputs. The single-ended clock input accepts LVCMOS or LVTTL input levels and translate them to 3.3V LVPECL levels. The clock enable is internally synchronized to eliminate runt clock pulses on the output during asynchronous assertion/deassertion of the clock enable pin. Guaranteed output an

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8535AGI-21LFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 14 Lead TSSOP-1
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8535AGI-21LFT - Renesas Electronics  - 3D model - Small Outline Packages - 14 Lead TSSOP-1
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8535AGI-21LFT Details

  • Manufacturer Part Number:

    8535AGI-21LFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    PGG14T1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    8535

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    1.6 ns

  • Propagation Delay (tpd):

    1.6 ns

  • Same Edge Skew-Max (tskwd):

    0.02 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • fmax-Min:

    266 MHz

8535AGI-21LFT Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN3804EU0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends following their thermal design guidelines, using a heat sink, and ensuring good airflow around the device. Additionally, consider using thermal interface materials and following proper soldering techniques.
  • Renesas recommends using a low-ESR capacitor (e.g., ceramic or film capacitor) for CIN and COUT, with values between 1-10uF and 1-22uF, respectively. The specific values depend on the application's requirements and should be determined through simulation and testing.
  • Check the PG signal's voltage level, ensure proper connection to the output voltage, and verify that the output voltage is within the specified range. Also, review the device's fault detection and protection features, such as overcurrent protection and undervoltage lockout.
  • Operating the device outside of its recommended conditions can lead to reduced performance, decreased reliability, and potentially even damage to the device. Always ensure that the device operates within its specified voltage, current, and temperature ranges.

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