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853S057AGILF - Renesas Electronics

Description: The 853S057I is a 4:1 Differential-to-3.3V or 2.5V LVPECL/ECL Clock/Data Multiplexer which can operate up to 3GHz and is a member of the HiPerClockS ™ family of High Performance Clock Solutions from IDT. The 853S057I has 4 differential selectable clock input pairs. The CLK/nCLK input pairs can accept LVPECL, LVDS, CML or SSTL levels. The fully differential architecture and low propagation delay make it ideal for use in clock distribution circuits. The multiplexer select control inputs have ECL/LVPECL interf

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853S057AGILF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG20
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853S057AGILF - Renesas Electronics  - 3D model - Small Outline Packages - PGG20
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853S057AGILF Details

  • Manufacturer Part Number:

    853S057AGILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    853S

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.615 ns

  • Propagation Delay (tpd):

    0.615 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    3000 MHz

853S057AGILF Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation. A thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K is recommended for heat sink attachment.
  • Use a shielded enclosure, and ensure a minimum of 1mm clearance between the device and any metal components. Implement a decoupling capacitor network and use a common-mode choke to reduce EMI. Follow the recommended PCB layout guidelines for signal and power traces.
  • Power-up sequence: VCC, then VDD, then AVCC. Power-down sequence: AVCC, then VDD, then VCC. Ensure a minimum of 100ms delay between power-up and power-down sequences. Use a soft-start circuit to prevent inrush currents.
  • Use the device's built-in power management features, such as dynamic voltage and frequency scaling. Optimize the clock frequency and voltage settings based on your application's requirements. Use the device's low-power modes and idle states to reduce power consumption.
  • Perform environmental testing (temperature, humidity, vibration) and electrical testing (signal integrity, power integrity) according to industry standards. Validate the device's performance using simulation tools and bench testing. Implement a comprehensive testing and validation plan to ensure the device meets your application's requirements.

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