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8550401EA - Texas Instruments

Description: Decoder/Demultiplexer Single 3-to-8 16-Pin CDIP Tube

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8550401EA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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8550401EA - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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8550401EA Details

  • Manufacturer Part Number:

    8550401EA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS

  • Family:

    HCT

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.56 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    3-LINE TO 8-LINE DECODER

  • Max I(ol):

    0.0052 A

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    INVERTED

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power Supply Current-Max (ICC):

    0.16 mA

  • Prop. Delay@Nom-Sup:

    45 ns

  • Propagation Delay (tpd):

    54 ns

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

8550401EA Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the input and output traces are well-separated to reduce noise and crosstalk.
  • The 8550401EA has a thermal pad on the bottom, which should be connected to a solid ground plane or a thermal relief pattern on the PCB. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if the device will be operating in high-temperature environments.
  • While the datasheet specifies the input common-mode range, it's essential to note that the device's performance may degrade if the input common-mode voltage approaches the supply rails. Ensure that the input signal is within the recommended range to maintain optimal performance and prevent damage to the device.
  • Use a combination of ceramic and electrolytic capacitors to decouple the power supply. Place the capacitors close to the device's power pins, and ensure that the capacitors are rated for the operating frequency and voltage. A good rule of thumb is to use a 10nF ceramic capacitor and a 10uF electrolytic capacitor in parallel.
  • The 8550401EA has a relatively high input impedance, which can affect the circuit's overall impedance and signal integrity. Ensure that the input signal is properly terminated, and consider using a buffer or impedance-matching network if necessary to maintain signal integrity.

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8550401EA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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