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87008AGILFT - Renesas Electronics

Description: The 87008I is a low skew, 1:8 LVCMOS/LVTTL Clock Generator. The device has 2 banks of 4 outputs and each bank can be independently selected for ÷1 or ÷2 frequency operation. Each bank also has its own power supply pins so that the banks can operate at the following different voltage levels: 3.3V, 2.5V, and 1.8V. The low impedance LVCMOS/ LVTTL outputs are designed to drive 50? series or parallel terminated transmission lines. The divide select inputs, DIV_SELA and DIV_SELB, control the output frequency of e

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87008AGILFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - (TSSOP)24_
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87008AGILFT - Renesas Electronics  - 3D model - Small Outline Packages - (TSSOP)24_
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87008AGILFT Details

  • Manufacturer Part Number:

    87008AGILFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    PGG24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    87008

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    54 mA

  • Prop. Delay@Nom-Sup:

    5.6 ns

  • Propagation Delay (tpd):

    5.6 ns

  • Same Edge Skew-Max (tskwd):

    0.15 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • fmax-Min:

    250 MHz

87008AGILFT Frequently Asked Questions (FAQs)

  • Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the power planes.
  • Renesas recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K between the device and the heat sink. Ensure the heat sink is properly attached and the system is designed to operate within the specified temperature range.
  • Renesas recommends using a minimum of 10 uF decoupling capacitors with an ESR of less than 1 ohm, placed as close as possible to the device. A pi-filter or LC filter can be used for power supply filtering, with a cutoff frequency of at least 10 kHz.
  • Renesas recommends using a human body model (HBM) ESD protection circuit with a minimum of 2 kV rating. The protection circuit should be placed as close as possible to the device, and the PCB should be designed to minimize parasitic capacitance.
  • Renesas recommends setting the internal regulators to the default values specified in the datasheet. However, the values can be adjusted based on the specific application requirements, such as output voltage and current. Consult the datasheet and application notes for more information.

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