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885012209028 - Würth Elektronik

Description: WCAP-CSGP General Purpose MLCC X7R1210106K025DFCT10000; SMT Chip; 10 µF ± 10%; 25 V(DC); -55°C / +125°C; size 1210; LxWxH 3.2 x 2.5 x 2.0; Term. Cu/Ni/Sn

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Symbol
885012209028 - Würth Elektronik - PCB symbol
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PCB Footprints
885012209028 - Würth Elektronik PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - 1210;3.2x2.5x2
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3D Models
885012209028 - Würth Elektronik - 3D model - Capacitor Chip Non-polarised - 1210;3.2x2.5x2
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885012209028 Details

  • Manufacturer Part Number:

    885012209028

  • Brand Name:

    Wurth Electronik

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    1210

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Manufacturer:

    Wurth Elektronik

  • YTEOL:

    15

  • Capacitance:

    10 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    2 mm

  • JESD-609 Code:

    e3

  • Length:

    3.2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    25 V

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    X7R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Width:

    2.5 mm

885012209028 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the 885012209028 can be found in the Wurth Elektronik's PCB Library or in the component's 3D model. It's essential to follow the recommended footprint to ensure proper assembly and to prevent thermal and mechanical stress.
  • The 885012209028 has a thermal pad on the bottom side, which should be connected to a thermal via or a copper plane on the PCB to dissipate heat efficiently. Ensure that the thermal via or copper plane is connected to a heat sink or a metal plate to prevent overheating.
  • The recommended soldering process for the 885012209028 is a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the component.
  • To ensure the reliability of the 885012209028 in high-vibration environments, it's essential to follow the recommended PCB design and assembly guidelines. Additionally, consider using a conformal coating or potting compound to protect the component from mechanical stress and environmental factors.
  • The 885012209028 is an ESD-sensitive component and requires proper handling and storage procedures to prevent damage. Ensure that all personnel handling the component wear ESD-protective wrist straps or use ESD-protective mats, and store the component in ESD-protective packaging.

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885012209028 Overview

Use the download button to access the 885012209028 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 88501, or try a keyword search, such as Ceramic Capacitors

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