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89HPES24T6G2ZCALGI - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and five downstream ports or peer-to-peer switching between downstream ports.

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89HPES24T6G2ZCALGI - Renesas Electronics PCB footprint - BGA - BGA - ALG324-1
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89HPES24T6G2ZCALGI - Renesas Electronics  - 3D model - BGA - ALG324-1
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89HPES24T6G2ZCALGI Details

  • Manufacturer Part Number:

    89HPES24T6G2ZCALGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    BGA-676

  • Pin Count:

    324

  • Manufacturer Package Code:

    ALG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    625 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.42 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES24T6G2ZCALGI Frequently Asked Questions (FAQs)

  • Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the power and ground planes.
  • To ensure reliable communication, use a common mode choke or a ferrite bead to filter out electromagnetic interference (EMI) and ensure signal integrity. Also, use a pull-up resistor on the bus lines to maintain signal levels.
  • Renesas recommends a power-up sequence of VCC, then VCCIO, and finally VREF. This ensures that the internal voltage regulators and analog circuits are properly initialized.
  • Implement a robust error handling mechanism using the device's built-in error detection and correction features, such as parity and checksum checks. Also, use interrupts to handle exceptions and errors in a timely manner.
  • The device has a maximum junction temperature of 150°C. Ensure good airflow around the device, and use thermal interface materials (TIMs) to reduce thermal resistance. Avoid hot spots and thermal gradients on the PCB.

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89HPES24T6G2ZCALGI Overview

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