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89HPES4T4ZBBCGI - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and three downstream ports or peer-to-peer switching between downstream ports.

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89HPES4T4ZBBCGI - Renesas Electronics PCB footprint - BGA - BGA - 144-LEAD BGA [13 X 13]
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3D Models
89HPES4T4ZBBCGI - Renesas Electronics  - 3D model - BGA - 144-LEAD BGA [13 X 13]
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89HPES4T4ZBBCGI Details

  • Manufacturer Part Number:

    89HPES4T4ZBBCGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Package Description:

    BGA-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    BCG144

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    312.5 MBps

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA144,12X12,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES4T4ZBBCGI Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 89HPES4T4ZBBCGI is -40°C to 85°C, as specified in the datasheet. However, it's essential to note that the device can tolerate a wider temperature range during storage, which is -55°C to 150°C.
  • To ensure reliable data transfer, it's crucial to follow the USB specification guidelines, use a robust clocking scheme, and implement proper error handling mechanisms. Additionally, consider using a USB signal integrity analysis tool to verify the signal quality and ensure compliance with the USB standard.
  • The 89HPES4T4ZBBCGI has a typical active mode current consumption of 150 mA at 3.3V, and a standby current consumption of 10 μA at 3.3V. However, the actual power consumption may vary depending on the specific application, clock frequency, and operating conditions. It's recommended to consult the datasheet and perform thorough power analysis during the design phase.
  • The 89HPES4T4ZBBCGI has a flexible clocking system that can be configured using the Clock Control Register (CCR). To optimize performance, it's essential to select the appropriate clock source, configure the clock dividers, and enable/disable clock gating as needed. Consult the datasheet and application notes for detailed guidance on clock configuration.
  • When designing a PCB layout for the 89HPES4T4ZBBCGI, it's crucial to consider signal integrity, power supply decoupling, and thermal management. Ensure that the PCB layout follows the recommended land pattern, and that the signal traces are properly routed to minimize noise and crosstalk. Additionally, consider using thermal vias and heat sinks to dissipate heat effectively.

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89HPES4T4ZBBCGI Overview

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