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89HPES5T5ZBBCGI8 - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and four downstream ports or peer-to-peer switching between downstream ports.

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89HPES5T5ZBBCGI8 - Renesas Electronics PCB footprint - BGA - BGA - 196-Pin BGA
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89HPES5T5ZBBCGI8 - Renesas Electronics  - 3D model - BGA - 196-Pin BGA
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89HPES5T5ZBBCGI8 Details

  • Manufacturer Part Number:

    89HPES5T5ZBBCGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Package Description:

    CABGA-196

  • Pin Count:

    196

  • Manufacturer Package Code:

    BCG196

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI; SMBUS

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    2500 MBps

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA196,14X14,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES5T5ZBBCGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) document, which includes thermal vias, thermal pads, and heat sink recommendations to ensure optimal thermal performance.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application note, which provides a detailed power-up and power-down sequence.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 10uF to 22uF, placed as close as possible to the device's power pins. The exact capacitor values and placement can be found in the device's layout guide or application note.
  • Renesas provides a troubleshooting guide in their application note or user manual, which includes common issues, symptoms, and solutions. Additionally, Renesas offers technical support and FAQs on their website to help engineers troubleshoot issues.
  • The 89HPES5T5ZBBCGI8 is rated for operation in a specific temperature range (-40°C to 125°C) and humidity range (5% to 95% RH). It's essential to ensure that the device operates within these conditions to guarantee reliable performance and prevent damage.

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89HPES5T5ZBBCGI8 Overview

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