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89HPES6T6G2ZCALGI - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and five downstream ports or peer-to-peer switching between downstream ports.

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89HPES6T6G2ZCALGI - Renesas Electronics PCB footprint - BGA - BGA - ALG324
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89HPES6T6G2ZCALGI - Renesas Electronics  - 3D model - BGA - ALG324
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89HPES6T6G2ZCALGI Details

  • Manufacturer Part Number:

    89HPES6T6G2ZCALGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    FCBGA-324

  • Pin Count:

    324

  • Manufacturer Package Code:

    ALG324

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    SMBUS

  • Clock Frequency-Max:

    100 MHz

  • Data Transfer Rate-Max:

    625 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.42 mm

  • Supply Current-Max:

    1127 mA

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES6T6G2ZCALGI Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide and thermal design guidelines in their application notes and whitepapers. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • Renesas offers power management ICs (PMICs) specifically designed for their microcontrollers. Engineers should consult the PMIC datasheet and application notes for optimal power management configuration and design guidelines.
  • Renesas provides security guidelines and recommendations in their documentation and application notes. Engineers should implement secure boot mechanisms, encrypt sensitive data, and follow secure coding practices to minimize potential security risks.
  • Renesas offers a range of development tools, including debuggers, emulators, and evaluation boards. Engineers can use these tools to debug and test their designs. Additionally, Renesas provides documentation and application notes on troubleshooting common issues and debugging techniques.
  • The 89HPES6T6G2ZCALGI is designed to operate within specific temperature, voltage, and humidity ranges. Engineers should consult the datasheet and application notes for environmental and operating condition specifications, and design their systems accordingly to ensure reliable operation in harsh environments.

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89HPES6T6G2ZCALGI Overview

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