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8P34S1102NLGI - Renesas Electronics

Description: The 8P34S1102 is a high-performance differential LVDS fanout buffer. The device is designed for the fanout of 1PPS signals or high-frequency, very low additive phase-noise clock and data signals. The 8P34S1102 supports fail-safe operation and is characterized to operate from a 1.8V or 2.5V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the 8P34S1102 ideal for those clock distribution applications demanding well-defined performance and repeatability. One differential inp

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8P34S1102NLGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG16P2-ren1
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8P34S1102NLGI - Renesas Electronics  - 3D model - Quad Flat No-Lead - NLG16P2-ren1
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8P34S1102NLGI Details

  • Manufacturer Part Number:

    8P34S1102NLGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    16

  • Manufacturer Package Code:

    NLG16P2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Family:

    8P34

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    48 mA

  • Prop. Delay@Nom-Sup:

    0.4 ns

  • Propagation Delay (tpd):

    0.4 ns

  • Same Edge Skew-Max (tskwd):

    0.015 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

8P34S1102NLGI Frequently Asked Questions (FAQs)

  • A good PCB layout for the 8P34S1102NLGI involves keeping the clock input traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the crystal oscillator. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power and decoupling, use a high-quality power supply with low noise and ripple. Add decoupling capacitors (e.g., 0.1uF and 10uF) close to the device's power pins, and use a 10kΩ resistor in series with the power supply to prevent voltage spikes.
  • The 8P34S1102NLGI has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device will be operating in a high-temperature environment. Also, avoid overheating the device during soldering or rework.
  • To configure the 8P34S1102NLGI for a specific clock frequency, use the device's register settings to select the desired frequency. Consult the datasheet for specific register settings and equations to calculate the required values. Additionally, ensure the crystal oscillator is properly selected and configured for the desired frequency.
  • To minimize EMI and RFI, use a shielded enclosure, keep clock traces short and away from other signals, and use a common-mode choke or ferrite bead on the clock input. Additionally, ensure the PCB layout is designed to minimize radiation and use EMI-absorbing materials if necessary.

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