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8P34S1208NBGI - Renesas Electronics

Description: The 8P34S1208 is a high-performance differential LVDS fanout buffer. The device is designed for the fanout of 1PPS signals or high-frequency, very low additive phase-noise clock and data signals. The 8P34S1208 supports fail-safe operation and is characterized to operate from a 1.8V or 2.5V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the 8P34S1208 ideal for those clock distribution applications demanding well-defined performance and repeatability. Two selectable diffe

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8P34S1208NBGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN
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8P34S1208NBGI - Renesas Electronics  - 3D model - Quad Flat No-Lead - QFN
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8P34S1208NBGI Details

  • Manufacturer Part Number:

    8P34S1208NBGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    28

  • Manufacturer Package Code:

    NBG28P1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-09-08

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES AT 2.5 V SUPPLY

  • Family:

    8P34

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-PQCC-N28

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    140 mA

  • Prop. Delay@Nom-Sup:

    0.4 ns

  • Propagation Delay (tpd):

    0.4 ns

  • Same Edge Skew-Max (tskwd):

    0.04 ns

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

8P34S1208NBGI Frequently Asked Questions (FAQs)

  • A good PCB layout for the 8P34S1208NBGI involves keeping the power and ground planes separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power and decoupling, connect a 1uF capacitor between the VDD pin and the GND pin, and a 10uF capacitor between the VDD pin and the GND pin. Also, ensure that the power supply is stable and can provide the required current.
  • The 8P34S1208NBGI can operate at frequencies up to 1208 MHz, but the maximum frequency may vary depending on the specific application and system design.
  • To configure the 8P34S1208NBGI for a specific clock frequency, use the device's register settings to set the desired frequency. Refer to the datasheet for specific register settings and equations to calculate the required values.
  • To manage thermal issues, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking airflow around the device. Also, consider using thermal interface materials to improve heat transfer.

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