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8P34S1208NBGI8 - Renesas Electronics

Description: The 8P34S1208 is a high-performance differential LVDS fanout buffer. The device is designed for the fanout of 1PPS signals or high-frequency, very low additive phase-noise clock and data signals. The 8P34S1208 supports fail-safe operation and is characterized to operate from a 1.8V or 2.5V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the 8P34S1208 ideal for those clock distribution applications demanding well-defined performance and repeatability. Two selectable diffe

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8P34S1208NBGI8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN
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8P34S1208NBGI8 - Renesas Electronics  - 3D model - Quad Flat No-Lead - QFN
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8P34S1208NBGI8 Details

  • Manufacturer Part Number:

    8P34S1208NBGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    28

  • Manufacturer Package Code:

    NBG28P1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-09-08

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES AT 2.5 V SUPPLY

  • Family:

    8P34

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-PQCC-N28

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    140 mA

  • Prop. Delay@Nom-Sup:

    0.4 ns

  • Propagation Delay (tpd):

    0.4 ns

  • Same Edge Skew-Max (tskwd):

    0.04 ns

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

8P34S1208NBGI8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Decoupling capacitors should be placed close to the power pins, and signal traces should be kept short and away from noise sources.
  • Ensure that the device is operated within the recommended voltage and current specifications, and that the PCB is designed to minimize thermal resistance. Use thermal vias and thermal pads to dissipate heat effectively.
  • Power up the device in the following sequence: VCC, VCCIO, and then VREF. Ensure that the reset pin is held low for at least 10ms during power-up, and that the reset signal is synchronized with the clock signal.
  • Use a clock tree with a single clock source and a balanced tree structure. Use clock buffers to reduce jitter and skew, and ensure that the clock signal is routed away from noise sources.
  • Use a series termination scheme for the high-speed interfaces, with a 50-ohm resistor in series with the signal line. Ensure that the termination resistors are placed close to the device pins.

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