Part Image

8P34S1212NLGI - Renesas Electronics

Description: The 8P34S1212 is a high-performance differential LVDS fanout buffer. The device is designed for the fanout of 1PPS signals or high-frequency, very low additive phase-noise clock and data signals. The 8P34S1212 supports fail-safe operation and is characterized to operate from a 1.8V or 2.5V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the 8P34S1212 ideal for those clock distribution applications demanding well-defined performance and repeatability. Two selectable diffe

Download 8P34S1212NLGI Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
8P34S1212NLGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG40P2--ren1
click to zoom
3D Models
8P34S1212NLGI - Renesas Electronics  - 3D model - Quad Flat No-Lead - NLG40P2--ren1
click to zoom

8P34S1212NLGI Details

  • Manufacturer Part Number:

    8P34S1212NLGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    40

  • Manufacturer Package Code:

    NLG40P2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-09-08

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES AT 2.5V SUPPLY

  • Family:

    8P34

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Number of True Outputs:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    227 mA

  • Prop. Delay@Nom-Sup:

    0.45 ns

  • Propagation Delay (tpd):

    0.45 ns

  • Same Edge Skew-Max (tskwd):

    0.045 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

8P34S1212NLGI Frequently Asked Questions (FAQs)

  • A good PCB layout for the 8P34S1212NLGI involves keeping the clock input traces as short as possible, using a solid ground plane, and minimizing the distance between the crystal and the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power and decoupling, use a high-quality decoupling capacitor (e.g., 0.1uF) as close to the VDD pin as possible. Additionally, use a 10uF or larger capacitor on the VDD pin to filter out noise. Make sure to follow the recommended power-up sequence and ensure a stable voltage supply.
  • The 8P34S1212NLGI has a maximum junction temperature of 150°C. To ensure reliable operation, keep the device within the recommended operating temperature range (–40°C to 85°C). Use a thermal pad or heat sink if the device is expected to operate in high-temperature environments or under high-load conditions.
  • To configure the 8P34S1212NLGI for use with a specific crystal oscillator frequency, refer to the device's datasheet for the recommended crystal oscillator circuit and component values. Ensure the crystal oscillator frequency is within the device's specified range (10MHz to 40MHz).
  • To minimize EMI and RFI, use a shielded enclosure, keep the device and associated components away from antennas and other EMI-sensitive components, and use EMI-absorbing materials. Ensure proper grounding and shielding of cables and connectors. Follow good PCB design practices, such as using a solid ground plane and minimizing signal trace lengths.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

8P34S1212NLGI Overview

Use the download button to access the 8P34S1212NLGI schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 8P34S, or try a keyword search, such as Clock Drivers

Parts related to 8P34S1212NLGI

Showing 0 results