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8P34S2102NLGI - Renesas Electronics

Description: The 8P34S2102 is a high-performance, low-power, differential dual 1:2 LVDS output, 1.8V/2.5V fanout buffer. The device supports fail-safe operation and is designed for the fanout of high-frequency, very low additive phase-noise clock and data signals. Two independent buffer channels are available. Each channel has two low-skew outputs. High isolation between channels minimizes noise coupling. AC characteristics such as propagation delay are matched between channels. Guaranteed output-to-output and part-to-p

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8P34S2102NLGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16 l qfn
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8P34S2102NLGI - Renesas Electronics  - 3D model - Quad Flat No-Lead - 16 l qfn
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8P34S2102NLGI Details

  • Manufacturer Part Number:

    8P34S2102NLGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    16

  • Manufacturer Package Code:

    NLG16P2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-09-09

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Family:

    8P

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    120 mA

  • Prop. Delay@Nom-Sup:

    0.4 ns

  • Propagation Delay (tpd):

    0.4 ns

  • Same Edge Skew-Max (tskwd):

    0.03 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

8P34S2102NLGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN9834) and evaluation board documentation. It's essential to follow these guidelines to ensure proper signal integrity, power supply decoupling, and thermal management.
  • The 8P34S2102NLGI is a highly configurable device. To set a specific clock frequency, refer to the device's register map and programming guide (e.g., Section 5 of the datasheet). You'll need to program the appropriate registers to configure the clock source, divider, and multiplier settings.
  • The 8P34S2102NLGI has a thermal junction-to-case rating of 125°C. To ensure reliable operation, it's crucial to provide adequate heat sinking, such as a thermal pad or heat sink, and to follow proper PCB thermal design guidelines. Renesas also provides thermal management guidelines in their application notes.
  • To troubleshoot power management issues, start by reviewing the device's power mode settings and configuration. Check the power management registers, voltage regulator settings, and clock gating configurations. Use Renesas' development tools, such as the Synergy Configurator or e² studio, to debug and analyze the device's behavior.
  • The 8P34S2102NLGI is designed to meet various EMI and EMC standards. To ensure compliance, follow Renesas' guidelines for PCB layout, component selection, and shielding. Additionally, consider using EMI filters, chokes, or other noise reduction techniques to minimize electromagnetic interference.

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