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8P34S2108NLGI8 - Renesas Electronics

Description: The 8P34S2108 is a high-performance, low-power, differential dual 1:6 LVDS output 1.8V/2.5V fanout buffer. The device supports fail-safe operation and is designed for the fanout of high-frequency, very low additive phase-noise clock and data signals. Two independent buffer channels are available, each channel has eight low skew outputs. High isolation between channels minimizes noise coupling. AC characteristics such as propagation delay are matched between channels. Guaranteed output-to-output and part-to-

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8P34S2108NLGI8 - Renesas Electronics - PCB symbol
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PCB Footprints
8P34S2108NLGI8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG48P1
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3D Models
8P34S2108NLGI8 - Renesas Electronics - 3D model - Quad Flat No-Lead - NLG48P1
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8P34S2108NLGI8 Details

  • Manufacturer Part Number:

    8P34S2108NLGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    48

  • Manufacturer Package Code:

    NLG48P1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-09-09

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Family:

    8P34

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    48

  • Number of True Outputs:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    495 mA

  • Prop. Delay@Nom-Sup:

    0.4 ns

  • Propagation Delay (tpd):

    0.4 ns

  • Same Edge Skew-Max (tskwd):

    0.04 ns

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

8P34S2108NLGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APNK0401) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • Renesas recommends using a low-ESR capacitor (e.g., 0.1uF) for power supply decoupling, and placing it as close as possible to the VDD pin. Additionally, ensure the power supply voltage is within the recommended range (1.71V to 1.89V) and use a stable voltage regulator.
  • The maximum clock frequency for the 8P34S2108NLGI8 is 2108 MHz, but it's recommended to consult the specific application note or datasheet for the specific clock frequency requirements and any necessary adjustments for the target application.
  • Renesas provides application notes and design guides for specific use cases, such as PCIe (APNK0403) and SATA (APNK0404). These guides provide detailed configuration and implementation information for the 8P34S2108NLGI8 in these specific applications.
  • Renesas recommends using a thermal pad or heat sink to dissipate heat generated by the 8P34S2108NLGI8. The thermal pad should be connected to a solid ground plane to ensure effective heat dissipation. Additionally, ensure the PCB design allows for adequate airflow and thermal conduction.

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8P34S2108NLGI8 Overview

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