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8S89832AKILFT - Renesas Electronics

Description: The 8S89832I is a high speed 1-to-4 Differential-to-LVDS Fanout Buffer. The 8S89832I is optimized for high speed and very low output skew, making it suitable for use in demanding applications such as SONET, 1 Gigabit and 10 Gigabit Ethernet, and Fibre Channel. The internally terminated differential input and VREF_AC pin allow other differential signal families such as LVPECL, LVDS, and SSTL to be easily interfaced to the input with minimal use of external components. The device also has an output enable pin

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8S89832AKILFT - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG16P2-ren1
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8S89832AKILFT - Renesas Electronics  - 3D model - Quad Flat No-Lead - NLG16P2-ren1
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8S89832AKILFT Details

  • Manufacturer Part Number:

    8S89832AKILFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Package Description:

    LCC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    NLG16P2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Family:

    S

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Inverted Outputs:

    4

  • Number of Terminals:

    16

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    95 mA

  • Prop. Delay@Nom-Sup:

    0.55 ns

  • Propagation Delay (tpd):

    0.55 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.025 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • fmax-Min:

    2000 MHz

8S89832AKILFT Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • Renesas recommends following the power sequencing guidelines outlined in their datasheet and application notes. Typically, this involves powering up the voltage regulators in a specific order to prevent damage or malfunction. A power sequencing diagram can be found in the datasheet or APN documents.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 10uF to 22uF, and a voltage rating of 6.3V or higher. The capacitors should be placed as close as possible to the power pins of the device. Refer to the datasheet or APN documents for more information.
  • Renesas provides troubleshooting guides and FAQs on their website, which cover common issues and solutions. Additionally, engineers can use tools like oscilloscopes, logic analyzers, and debuggers to identify and debug issues. Renesas also offers technical support and application notes to help with troubleshooting.
  • Renesas recommends considering thermal design factors such as junction temperature, thermal resistance, and power dissipation when designing with the 8S89832AKILFT. Engineers should ensure proper heat sinking, thermal vias, and airflow to prevent overheating and ensure reliable operation.

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