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8SLVP1204ANLGI8 - Renesas Electronics

Description: The 8SLVP1204 is a high-performance differential LVPECL fanout buffer. The device is designed for the fanout of high-frequency, very low additive phase-noise clock and data signals. The 8SLVP1204 is characterized to operate from a 3.3V or 2.5V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the 8SLVP1204 ideal for those clock distribution applications demanding well-defined performance and repeatability. Two selectable differential inputs and four low skew outputs are av

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8SLVP1204ANLGI8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG16P2-ren1
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8SLVP1204ANLGI8 - Renesas Electronics  - 3D model - Quad Flat No-Lead - NLG16P2-ren1
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8SLVP1204ANLGI8 Details

  • Manufacturer Part Number:

    8SLVP1204ANLGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    16

  • Manufacturer Package Code:

    NLG16P2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Family:

    8S

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.32 ns

  • Propagation Delay (tpd):

    0.32 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.025 ns

  • Seated Height-Max:

    1.05 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

8SLVP1204ANLGI8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The datasheet provides a recommended land pattern, but additional thermal vias and a solid ground plane can help to further reduce thermal resistance.
  • To ensure reliable operation across the full temperature range, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
  • Using a different VRM than the one recommended in the datasheet may affect the overall system performance, power efficiency, and thermal characteristics. It's essential to evaluate the compatibility and performance of the chosen VRM with the 8SLVP1204ANLGI8 to ensure reliable operation.
  • To troubleshoot POR and BOD issues, verify that the power supply is stable and within the recommended voltage range. Check the reset circuitry and ensure that the POR and BOD thresholds are set correctly. Also, review the system's power-up sequence and ensure that the 8SLVP1204ANLGI8 is properly reset during power-on.
  • To minimize EMC and EMI issues, follow proper PCB layout and design guidelines, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. Additionally, ensure that the system meets the relevant EMC and EMI standards for the target application.

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