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8SLVP1212ANLGI8 - Renesas Electronics

Description: The 8SLVP1212I is a high-performance, 12 output differential LVPECL fanout buffer. The device is designed for the fanout of high-frequency, very low additive phase-noise clock and data signals. The 8SLVP1212I is characterized to operate from a 3.3V and 2.5V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the 8SLVP1212I ideal for those clock distribution applications demanding well-defined performance and repeatability. Two selectable differential inputs and twelve low sk

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8SLVP1212ANLGI8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG40P1*
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8SLVP1212ANLGI8 - Renesas Electronics  - 3D model - Quad Flat No-Lead - NLG40P1*
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8SLVP1212ANLGI8 Details

  • Manufacturer Part Number:

    8SLVP1212ANLGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    40

  • Manufacturer Package Code:

    NLG40P1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Family:

    8SLVP

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Number of True Outputs:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.55 ns

  • Propagation Delay (tpd):

    0.55 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.033 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

8SLVP1212ANLGI8 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The datasheet provides a recommended land pattern, but additional thermal design considerations should be taken into account.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and thermal management. Additionally, consider using thermal simulation tools to analyze the device's thermal performance.
  • In high-reliability applications, it is crucial to consider the device's failure modes, fault tolerance, and redundancy. The 8SLVP1212ANLGI8 is designed for high-reliability applications, but additional design considerations, such as error correction and redundancy, may be necessary to ensure the required level of reliability.
  • To optimize power consumption, consider using power-saving modes, reducing clock frequencies, and optimizing the device's voltage and current settings. Additionally, consider using power management ICs or other power-saving technologies to minimize power consumption.
  • To minimize EMI and EMC issues, follow the recommended PCB layout and design guidelines, use shielding and filtering, and consider using EMI-absorbing materials. Additionally, ensure that the device is properly decoupled and that the power supply is well-regulated.

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