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8T79S308NLGI - Renesas Electronics

Description: The 8T79S308 is a fully integrated signal fanout buffer for high-performance, low additive phase noise applications. The main function of the device is the distribution and fanout of high-frequency clocks or low-frequency synchronization signals. The 8T79S308 is optimized to deliver very low phase noise clocks and precise, low-skew outputs, low device-to-device skew characteristics and fast output rise/fall times help the system design to achieve deterministic clock phase relationship across devices.The dev

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8T79S308NLGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 8T49N241-998NLGI-1-
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8T79S308NLGI - Renesas Electronics  - 3D model - Quad Flat No-Lead - 8T49N241-998NLGI-1-
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8T79S308NLGI Details

  • Manufacturer Part Number:

    8T79S308NLGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Package Description:

    VFQFPN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    NLG40P2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Additional Feature:

    IT ALSO OPERATES AT 3.3V

  • Family:

    8T

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.004 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Number of True Outputs:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    457 mA

  • Prop. Delay@Nom-Sup:

    0.75 ns

  • Propagation Delay (tpd):

    0.75 ns

  • Same Edge Skew-Max (tskwd):

    0.035 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

  • fmax-Min:

    3000 MHz

8T79S308NLGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN9834) and evaluation board documentation. It's essential to follow these guidelines to ensure proper signal integrity, power supply decoupling, and thermal management.
  • The clock input configuration depends on the specific application. Renesas provides clock configuration guidelines in their datasheet and application notes. Typically, a crystal oscillator or an external clock source is required, and the clock input pin (CLKIN) should be connected to the clock source with proper termination and decoupling.
  • The maximum operating temperature range for the 8T79S308NLGI is -40°C to +85°C. However, it's essential to consider the specific application's thermal requirements and ensure proper thermal management to prevent overheating.
  • Renesas provides guidelines for implementing POR and BOD in their application notes and datasheet. Typically, an external POR circuit is required, and the BOD threshold voltage should be set according to the specific application's requirements.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors (e.g., 100nF to 1uF) with a voltage rating suitable for the specific application. The capacitors should be placed close to the power pins and connected to a solid ground plane to ensure proper power supply decoupling.

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