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8T79S308NLGI8 - Renesas Electronics

Description: The 8T79S308 is a fully integrated signal fanout buffer for high-performance, low additive phase noise applications. The main function of the device is the distribution and fanout of high-frequency clocks or low-frequency synchronization signals. The 8T79S308 is optimized to deliver very low phase noise clocks and precise, low-skew outputs, low device-to-device skew characteristics and fast output rise/fall times help the system design to achieve deterministic clock phase relationship across devices.The dev

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PCB Footprints
8T79S308NLGI8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 40-Lead VFQFN-
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8T79S308NLGI8 - Renesas Electronics  - 3D model - Quad Flat No-Lead - 40-Lead VFQFN-
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8T79S308NLGI8 Details

  • Manufacturer Part Number:

    8T79S308NLGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Package Description:

    VFQFPN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    NLG40P2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Additional Feature:

    IT ALSO OPERATES AT 3.3V

  • Family:

    8T

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.004 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Number of True Outputs:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    457 mA

  • Prop. Delay@Nom-Sup:

    0.75 ns

  • Propagation Delay (tpd):

    0.75 ns

  • Same Edge Skew-Max (tskwd):

    0.035 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

  • fmax-Min:

    3000 MHz

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Manufacturer Collaborated
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8T79S308NLGI8 Overview

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