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93AA86C-I/P - Microchip

Description: Microchip 93AA86C-I/P Serial EEPROM Memory, 16kbit, 400ns, 1.8 → 5.5 V 8-Pin PDIP

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93AA86C-I/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
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93AA86C-I/P - Microchip  - 3D model - Dual-In-Line Packages - 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
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93AA86C-I/P Details

  • Manufacturer Part Number:

    93AA86C-I/P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    PDIP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Alternate Memory Width:

    8

  • Clock Frequency-Max (fCLK):

    1 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.27 mm

  • Memory Density:

    16384 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    1024 words

  • Number of Words Code:

    1000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1KX16

  • Output Characteristics:

    TOTEM POLE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    SERIAL

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Reverse Pinout:

    NO

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    5.334 mm

  • Serial Bus Type:

    MICROWIRE

  • Standby Current-Max:

    0.000001 A

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Toggle Bit:

    YES

  • Width:

    7.62 mm

  • Write Cycle Time-Max (tWC):

    6 ms

  • Write Protection:

    SOFTWARE

93AA86C-I/P Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the 93AA86C-I/P is 2.5V to 5.5V, with a typical operating voltage of 3.3V.
  • To implement a reliable write cycle, ensure that the WP pin is tied to VCC, and the device is powered up properly before writing. Also, follow the recommended write cycle timing and pulse widths as specified in the datasheet.
  • The 93AA86C-I/P has a minimum of 100,000 write cycles, with a maximum of 1,000,000 write cycles, depending on the operating conditions and usage.
  • To protect the 93AA86C-I/P from data corruption during power-down, ensure that the device is properly powered down, and the VCC pin is brought down to 0V before the WP pin. This will prevent any accidental writes during power-down.
  • The 93AA86C-I/P is rated for operation up to 125°C, but it's recommended to derate the operating temperature to ensure reliable operation. Consult the datasheet for specific temperature derating guidelines.

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93AA86C-I/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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