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93LC56BT-I/ST - Microchip

Description: EEPROM Serial-Microwire 2K-bit 128 x 16 3.3V/5V 8-Pin TSSOP T/R

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PCB Footprints
93LC56BT-I/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead ST TSSOP
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3D Models
93LC56BT-I/ST - Microchip  - 3D model - Small Outline Packages - 8 Lead ST TSSOP
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93LC56BT-I/ST Details

  • Manufacturer Part Number:

    93LC56BT-I/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TSSOP-8

  • Country Of Origin:

    Malaysia, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS

  • Alternate Memory Width:

    8

  • Clock Frequency-Max (fCLK):

    2 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Memory Density:

    2048 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    128 words

  • Number of Words Code:

    128

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128X16

  • Output Characteristics:

    TOTEM POLE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Reverse Pinout:

    NO

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    MICROWIRE

  • Standby Current-Max:

    0.000001 A

  • Supply Current-Max:

    0.002 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Toggle Bit:

    YES

  • Width:

    3 mm

  • Write Cycle Time-Max (tWC):

    6 ms

  • Write Protection:

    SOFTWARE

93LC56BT-I/ST Frequently Asked Questions (FAQs)

  • The maximum clock frequency for the 93LC56BT-I/ST is 3.2 MHz.
  • To ensure data integrity, use the Write Enable Latch (WEL) and Write Protect (WP) pins to control write operations. Also, use the built-in CRC feature to detect data corruption.
  • The VCC pin is the power supply pin for the device, and it should be connected to a 2.5V to 5.5V power source.
  • Yes, the 93LC56BT-I/ST is compatible with 3.3V systems, but ensure that the power supply voltage is within the recommended range of 2.5V to 5.5V.
  • To erase the entire memory array, use the Chip Erase (CE) command. This will reset the entire memory array to its default state.

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93LC56BT-I/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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