93LC66B-I/P - Microchip

93LC66B-I/P Details

• Manufacturer Part Number:

  93LC66B-I/P

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  DIP

• Package Description:

  DIP-8

• Pin Count:

  8

• Manufacturer Package Code:

  PDIP-8

• Country Of Origin:

  Thailand

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Factory Lead Time:

  14 Weeks

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  8

• Additional Feature:

  1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS

• Clock Frequency-Max (fCLK):

  1 MHz

• Data Retention Time-Min:

  200

• Endurance:

  1000000 Write/Erase Cycles

• JESD-30 Code:

  R-PDIP-T8

• JESD-609 Code:

  e3

• Length:

  9.27 mm

• Memory Density:

  4096 bit

• Memory IC Type:

  EEPROM

• Memory Width:

  16

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  8

• Number of Words:

  256 words

• Number of Words Code:

  256

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  256X16

• Output Characteristics:

  TOTEM POLE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  DIP

• Package Equivalence Code:

  DIP8,.3

• Package Shape:

  RECTANGULAR

• Package Style:

  IN-LINE

• Parallel/Serial:

  SERIAL

• Qualification Status:

  Not Qualified

• Ready/Busy:

  YES

• Reverse Pinout:

  NO

• Screening Level:

  TS 16949

• Seated Height-Max:

  5.33 mm

• Serial Bus Type:

  MICROWIRE

• Standby Current-Max:

  0.000001 A

• Supply Current-Max:

  0.002 mA

• Supply Voltage-Max (Vsup):

  5.5 V

• Supply Voltage-Min (Vsup):

  1.8 V

• Supply Voltage-Nom (Vsup):

  2.5 V

• Surface Mount:

  NO

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  THROUGH-HOLE

• Terminal Pitch:

  2.54 mm

• Terminal Position:

  DUAL

• Toggle Bit:

  YES

• Width:

  7.62 mm

• Write Cycle Time-Max (tWC):

  6 ms

• Write Protection:

  SOFTWARE