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93LC66BT-I/MNY - Microchip

Description: EEPROM Serial-Microwire 4K-bit 256 x 16 3.3V/5V 8-Pin TDFN EP T/R - Tape and Reel

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PCB Footprints
93LC66BT-I/MNY - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-LEAD PLASTIC DUAL FLAT, NO LEAD PACKAGE (MN) - 2X3X0.75mm BODY [TDFN]
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3D Models
93LC66BT-I/MNY - Microchip  - 3D model - Small Outline No-lead - 8-LEAD PLASTIC DUAL FLAT, NO LEAD PACKAGE (MN) - 2X3X0.75mm BODY [TDFN]
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93LC66BT-I/MNY Details

  • Manufacturer Part Number:

    93LC66BT-I/MNY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Pin Count:

    8

  • Manufacturer Package Code:

    TDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    23 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Clock Frequency-Max (fCLK):

    2 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Memory Density:

    4096 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    256 words

  • Number of Words Code:

    256

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256X16

  • Output Characteristics:

    TOTEM POLE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Ready/Busy:

    YES

  • Reverse Pinout:

    NO

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    MICROWIRE

  • Standby Current-Max:

    0.000001 A

  • Supply Current-Max:

    0.002 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Toggle Bit:

    YES

  • Width:

    2 mm

  • Write Cycle Time-Max (tWC):

    6 ms

  • Write Protection:

    SOFTWARE

93LC66BT-I/MNY Frequently Asked Questions (FAQs)

  • The maximum clock frequency for the 93LC66BT-I/MNY is 3.4 MHz.
  • Yes, the 93LC66BT-I/MNY is compatible with 5V systems, but it can also operate at 2.5V, 3.3V, and other voltages within its specified operating range.
  • To ensure data integrity during power-up and power-down, it is recommended to use a voltage supervisor or a power-on reset (POR) circuit to ensure that the device is properly initialized and that the power supply is stable before accessing the memory.
  • The 93LC66BT-I/MNY is rated for operation up to 125°C, but it is recommended to consult the datasheet and application notes for specific guidance on using the device in high-temperature environments.
  • The 93LC66BT-I/MNY has built-in error detection and correction mechanisms, including a Write Enable Latch (WEL) and a Write Protect (WP) pin. It is recommended to use these features to detect and correct errors during write operations.

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93LC66BT-I/MNY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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