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9DB102BGILFT - Renesas Electronics

Description: The 9DB102 zero-delay buffer supports PCI Express clocking requirements. The 9DB102 is driven by a differential SRC output pair from an IDT CK409/CK410-compliant main clock generator such as the 952601 or 954101. It attenuates jitter on the input clock and has a selectable PLL Band Width to maximize performance in systems with or without Spread- Spectrum clocking.

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9DB102BGILFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PCG20-ren2
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9DB102BGILFT - Renesas Electronics  - 3D model - Small Outline Packages - PCG20-ren2
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9DB102BGILFT Details

  • Manufacturer Part Number:

    9DB102BGILFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    9DB

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.15 ns

  • Propagation Delay (tpd):

    0.15 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.025 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

9DB102BGILFT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal simulation tools to optimize the design.
  • A 0.1uF ceramic capacitor should be placed as close as possible to the device's power pins, with a 10uF electrolytic capacitor placed nearby to filter out low-frequency noise.
  • Check the oscillator's clock output using an oscilloscope, and verify that the oscillator is properly enabled and configured. Also, ensure that the device's power supply is stable and within the recommended range.
  • The internal voltage regulator is suitable for most applications, but may not provide the same level of noise rejection as an external regulator. An external regulator may be necessary for applications requiring high power supply rejection ratio (PSRR).

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9DB102BGILFT Overview

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