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9DB106BFILF - Renesas Electronics

Description: The 9DB106 zero-delay buffer supports PCIe Gen1 and Gen2 clocking requirements. The 9DB106 is driven by a differential SRC output pair from an IDT CK410/CK505-compliant main clock generator. It attenuates jitter on the input clock and has a selectable PLL bandwidth to maximize performance in systems with or without Spread-Spectrum clocking. An SMBus interface allows control of the PLL bandwidth and bypass options, while 2 clock request (CLKREQ#) pins make the 9DB106 suitable for Express Card applications.

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9DB106BFILF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 209 mil SSOP-28
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9DB106BFILF - Renesas Electronics  - 3D model - Small Outline Packages - 209 mil SSOP-28
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9DB106BFILF Details

  • Manufacturer Part Number:

    9DB106BFILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    PYG28

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    9DB

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of True Outputs:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    150 mA

  • Prop. Delay@Nom-Sup:

    0.15 ns

  • Propagation Delay (tpd):

    0.15 ns

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

9DB106BFILF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The 9DB106BFILF has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A heat sink or thermal interface material can be used to improve heat dissipation. Additionally, ensure good airflow around the device and avoid blocking the thermal pad.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) first, followed by the clock signal (CLK). This ensures that the device is properly initialized and configured before operation.
  • Renesas provides a troubleshooting guide in their application notes, which includes steps to identify and resolve common issues such as clock signal integrity, power supply noise, and signal integrity. Additionally, use oscilloscopes and logic analyzers to debug the device.
  • Renesas provides guidelines for using the 9DB106BFILF in high-reliability or safety-critical applications, including recommendations for fault tolerance, error detection and correction, and compliance with relevant industry standards such as IEC 61508 or ISO 26262.

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