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9DB801CGLF - Renesas Electronics

Description: The 9DB801C is a DB800 Version 2.0 Yellow Cover part with PCI Express® support. It can be used in PC or embedded systems to provide outputs that have low cycle-to-cycle jitter (50 ps), low output-to-output skew (100 ps), and are PCI Express® gen 1 compliant. The 9DB801C supports a 1 to 8 output configuration, taking a spread or non spread differential HCSL input from a CK410(B) main clock such as 954101 and 932S401, or any other differential HCSL pair. 9DB801C can generate HCSL or LVDS outputs from 50 to 20

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9DB801CGLF - Renesas Electronics - PCB symbol
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PCB Footprints
9DB801CGLF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG 48
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9DB801CGLF - Renesas Electronics - 3D model - Small Outline Packages - PAG 48
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9DB801CGLF Details

  • Manufacturer Part Number:

    9DB801CGLF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    6.10 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-153, TSSOP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    PAG48

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    9DB

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    12.5 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

9DB801CGLF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN1841) and evaluation board documentation. It's essential to follow these guidelines to ensure proper signal integrity, power supply decoupling, and thermal management.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This typically involves powering up the VCC and VCCIO pins in a specific order, followed by the VREF pin. Refer to the datasheet and application notes for detailed guidance.
  • The 9DB801CGLF has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat effectively. Ensure that the thermal pad is soldered to the PCB and connected to a heat sink or thermal vias to prevent overheating.
  • The 9DB801CGLF has various power-saving modes, such as the 'Low Power Mode' and 'Hibernate Mode'. These modes can be configured through register settings and clock control. Refer to the datasheet and application notes for detailed information on how to configure these modes.
  • Renesas provides guidelines for EMI and EMC compliance in their application notes and datasheet. Ensure that the PCB layout, component selection, and shielding meet the recommended guidelines to minimize electromagnetic interference and ensure compliance with regulatory standards.

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9DB801CGLF Overview

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9DB801CGLF Alternates

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