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9DBL0951BKILF - Renesas Electronics

Description: The 9DBL0951 device is a member of IDT's 3.3V full-featured PCIe clock family. The 9DBL0951 device supports PCIe Gen1-4 Common Clocked (CC) and PCIe Separate Reference Independent Spread (SRIS) systems. The device's integrated output terminations provide a direct connection to 85Ω transmission lines. The 9DBL09P1 can be factory programmed with a user-defined power up default SMBus configuration.For information regarding evaluation boards and material, please contact your local IDT sales representative.

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PCB Footprints
9DBL0951BKILF - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NDG48-ren1
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9DBL0951BKILF - Renesas Electronics  - 3D model - Quad Flat No-Lead - NDG48-ren1
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9DBL0951BKILF Details

  • Manufacturer Part Number:

    9DBL0951BKILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Package Description:

    VFQFPN-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    NDG48P2

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    9DBL

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of True Outputs:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.24SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    40 mA

  • Prop. Delay@Nom-Sup:

    4 ns

  • Propagation Delay (tpd):

    4 ns

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

9DBL0951BKILF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a decoupling capacitor (e.g., 0.1uF) close to the VCC pin.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device. Consider using a thermal interface material (e.g., thermal tape or thermal grease) to improve heat transfer.
  • The input clock signal should be a stable, low-jitter signal with a frequency range of 10MHz to 100MHz. The signal should be AC-coupled and have a voltage swing of at least 200mVpp.
  • Use a logic analyzer or oscilloscope to monitor the input clock signal and output signals. Check the power supply voltage and decoupling capacitors. Verify the PCB layout and signal routing. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • Yes, the 9DBL0951BKILF is a high-frequency device and requires proper EMI/EMC design considerations. Use a shielded enclosure, keep the device away from noise sources, and use EMI filters or shielding on the PCB.

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