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9FGL0441DKILF - Renesas Electronics

Description: The 9FGL0441/51 devices are 4-output  3.3V PCIe Gen1–5 clock generators. Each output has a dedicated OE# pin supporting PCIe CLKREQ# functionality. Two different spread spectrum levels, in addition to spread off, are supported. The 9FGL0441/51 supports PCIe Gen1–5 Common Clocked architectures (CC), PCIe Separate Reference no-Spread (SRNS) and Separate Reference Independent Spread (SRIS) clocking architectures. 

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9FGL0441DKILF - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 9FGL0441DKILF
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9FGL0441DKILF - Renesas Electronics  - 3D model - Quad Flat No-Lead - 9FGL0441DKILF
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9FGL0441DKILF Details

  • Manufacturer Part Number:

    9FGL0441DKILF

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks, 1 Day

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • JESD-30 Code:

    S-XQCC-N32

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Clock Frequency-Max:

    100 MHz

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Primary Clock/Crystal Frequency-Nom:

    25 MHz

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    39 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    CLOCK GENERATOR, PCIe

9FGL0441DKILF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN4461EJ0100) which includes thermal design considerations, such as thermal vias, copper pours, and heat sink attachment.
  • Renesas recommends a specific power sequencing scheme in their application note (R01AN4461EJ0100) to ensure proper device operation. The sequence involves powering up the VCC, then the VDD, and finally the AVCC.
  • Renesas recommends using 0.1uF to 1uF decoupling capacitors with a voltage rating of 10V or higher, placed as close as possible to the power pins. The exact value and type of capacitor may vary depending on the specific application and PCB layout.
  • Renesas provides a JTAG interface for debugging and testing. During production testing, it's recommended to use a JTAG adapter or a boundary scan tool to access the device's internal registers and perform testing. Renesas also provides a JTAG programming guide in their application note (R01AN4461EJ0100).
  • The thermal resistance values for the 9FGL0441DKILF package are not explicitly stated in the datasheet. However, Renesas provides thermal resistance values for similar packages in their thermal management application note (R01AN4461EJ0100). For the 9FGL0441DKILF, the thermal resistance values can be estimated as follows: RθJA = 30°C/W, RθJC = 10°C/W, and RθJB = 20°C/W.

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9FGL0441DKILF Overview

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