Description:The 9ZXL1950 is a DB1900Z derivative buffer utilizing Low-Power HCSL (LP-HCSL) outputs to increase edge rates on long traces, reduce board space, and reduce power consumption more than 50% from the original 9ZX21901.It is pin-compatible to the 9ZXL1930 and fully integrates the output terminations. It is pin-compatible to the 9ZXL1930 and fully integrates the output terminations. It is suitable for PCI-Express Gen1/2/3 or QPI/UPI applications, and uses a fixed external feedback to maintain low drift for dema
Renesas provides a recommended PCB layout guide in their application notes (e.g., AN1841) and design guides (e.g., DG-0134). It's essential to follow these guidelines to ensure optimal performance, minimize noise, and reduce EMI.
The 9ZXL1950BKLF has a thermal pad on the bottom, which requires a thermal interface material (TIM) for heat dissipation. Ensure a good thermal connection to a heat sink or a metal core PCB. Follow Renesas' thermal design guidelines and consider using thermal simulation tools to optimize your design.
Renesas recommends using a low-ESR ceramic capacitor (e.g., X5R or X7R) for CIN, with a value between 4.7 μF to 10 μF. For COUT, use a low-ESR capacitor with a value between 10 μF to 22 μF. Ensure the capacitors meet the specified voltage and temperature ratings.
The 9ZXL1950BKLF has a specific power-up sequence requirement. Ensure that the input voltage (VIN) is applied before the enable signal (EN). Also, ensure that the output voltage (VOUT) is stable before connecting it to the load. Refer to the datasheet and application notes for detailed power sequencing guidelines.
To minimize EMI and ensure EMC, follow Renesas' guidelines for PCB layout, component placement, and shielding. Use a shielded inductor, and consider adding EMI filters or common-mode chokes to the input and output lines. Ensure the device is placed in a shielded area, and use a metal core PCB or a PCB with a dedicated ground plane.
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9ZXL1950BKLF Overview
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