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A1006TL/TA1NXZ - NXP

Description: Security ICs / Authentication ICs Secure Authenticator

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Symbol
A1006TL/TA1NXZ - NXP - PCB symbol
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PCB Footprints
A1006TL/TA1NXZ - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - HXSON6
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3D Models
A1006TL/TA1NXZ - NXP - 3D model - Small Outline No-lead - HXSON6
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A1006TL/TA1NXZ Details

  • Manufacturer Part Number:

    A1006TL/TA1NXZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HXSON-6

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PDSO-N6

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.62 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

A1006TL/TA1NXZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the A1006TL/TA1NXZ should consider the following: keep the input and output traces short and symmetrical, use a solid ground plane, and place decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure EMC, follow these guidelines: use a shielded enclosure, keep the device away from high-frequency sources, use a common-mode choke on the input, and add a ferrite bead on the output. Additionally, ensure that the PCB layout is optimized for minimal radiation.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input. The capacitor should be placed as close as possible to the device's input pins. The capacitor value and type may vary depending on the specific application and input voltage.
  • The A1006TL/TA1NXZ has a thermal pad on the bottom. Ensure good thermal contact between the device and the PCB by using a thermal interface material (TIM) and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow around the device.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the output. The capacitor value and type may vary depending on the specific application and output voltage. The output capacitor should be placed as close as possible to the device's output pins.

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A1006TL/TA1NXZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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