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A1330LLETR-T - Allegro Microsystems

Description: Programmable Angle Sensor IC With Analog And PWM Output

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PCB Footprints
A1330LLETR-T - Allegro Microsystems PCB footprint - Other - Other - Package LE, 8-Pin eTSSOP
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3D Models
A1330LLETR-T - Allegro Microsystems  - 3D model - Other - Package LE, 8-Pin eTSSOP
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A1330LLETR-T Details

  • Manufacturer Part Number:

    A1330LLETR-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • Date Of Intro:

    2017-09-29

  • Manufacturer:

    Allegro MicroSystems LLC

  • Additional Feature:

    AEC-Q100

  • Body Breadth:

    3 mm

  • Body Height:

    1.1 mm

  • Body Length or Diameter:

    4.4 mm

  • Measurement Range-Max (deg):

    360 deg

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Current-Max:

    15 mA

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Range:

    24-34mA

  • Output Type:

    ANALOG CURRENT

  • Package Shape/Style:

    RECTANGULAR

  • Sensors/Transducers Type:

    ROTARY POSITION SENSOR,HALL EFFECT

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Termination Type:

    SOLDER

A1330LLETR-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the A1330LLETR-T involves keeping the sense lines as short as possible, using a ground plane to reduce noise, and placing the device close to the magnetic field source. Allegro provides a recommended PCB layout in their application notes.
  • Calibration involves adjusting the device's sensitivity and offset to match the specific application. Allegro provides a calibration procedure in their application notes, which involves applying a known magnetic field and adjusting the device's output to match the expected value.
  • The A1330LLETR-T is rated for operation from -40°C to 150°C, but the device's accuracy and sensitivity may degrade at extreme temperatures. It's essential to consider the temperature range of the application and ensure the device is operated within its specified range.
  • To minimize EMI and RFI, use shielding, filtering, and grounding techniques. Ensure the device is placed in a shielded area, and use filters to reduce high-frequency noise. Grounding the device and surrounding components can also help reduce interference.
  • A decoupling capacitor (e.g., 10 μF) should be placed close to the device's power pins to filter out noise and ensure stable operation. Additionally, a voltage regulator can be used to regulate the power supply and reduce noise.

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