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A3992SLPTR-T - Allegro Microsystems

Description: DMOS Dual Full Bridge Microstep Driver

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PCB Footprints
A3992SLPTR-T - Allegro Microsystems PCB footprint - Other - Other - LP Package, 24-Pin TSSOP
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3D Models
A3992SLPTR-T - Allegro Microsystems  - 3D model - Other - LP Package, 24-Pin TSSOP
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A3992SLPTR-T Details

  • Manufacturer Part Number:

    A3992SLPTR-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    1.2 MM HEIGHT, LEAD FREE, MO-153ADT, TSSOP-24

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Allegro MicroSystems LLC

  • YTEOL:

    8

  • Additional Feature:

    ALSO REQUIRES 15V TO 50V VBB SUPPLY

  • Analog IC - Other Type:

    STEPPER MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max (Isup):

    12 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    NMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4.4 mm

A3992SLPTR-T Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central thermal pad connected to a large copper area on the PCB is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's current output at high temperatures to prevent overheating.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device's input pins as possible to minimize noise and ensure stable operation.
  • Check the input voltage, output load, and PCB layout for any issues. Verify that the device is properly configured and that the output voltage is within the specified range. Use an oscilloscope to measure the output voltage and check for any signs of oscillation or instability.
  • The maximum allowed voltage drop across the output stage is typically 0.5V to 1.5V, depending on the specific application and output current. Exceeding this limit may cause the device to overheat or malfunction.

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A3992SLPTR-T Overview

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