Please enter a minimum 3 letters or numbers
Technical Content
Part Image

A3M40PD012 - NXP

Description: thermal enhanced low profile fine-pitch land grid array package, 13 terminals, 0.5 mm pitch, 2.2 mm x 2.2 mm x 0.68 mm body

Download A3M40PD012 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
A3M40PD012 - NXP - PCB symbol
click to zoom
PCB Footprints
A3M40PD012 - NXP PCB footprint - Other - Other - SOT2008-1
click to zoom
3D Models
A3M40PD012 - NXP - 3D model - Other - SOT2008-1
click to zoom

A3M40PD012 Details

  • Manufacturer Part Number:

    A3M40PD012

  • Manufacturer:

    NXP Semiconductors

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

A3M40PD012 Overview

Use the download button to access the A3M40PD012 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like A3M40, or try a keyword search, such as RF/Microwave Amplifiers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to A3M40PD012

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑