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A3P1000-FG144I - Microchip

Description: High Capacity • 15 K to 1 M System Gates • Up to 144 Kbits of True Dual-Port SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process • Instant On Level 0 Support • Single-Chip Solution • Retains Programmed Design when Powered Off High Performance • 350 MHz System Performance • 3.3 V, 66 MHz 64-Bit PCI† In-System Programming (ISP) and Security • ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM®-e

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A3P1000-FG144I - Microchip PCB footprint - BGA - BGA - FG144
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A3P1000-FG144I - Microchip  - 3D model - BGA - FG144
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A3P1000-FG144I Details

  • Manufacturer Part Number:

    A3P1000-FG144I

  • Part Life Cycle Code:

    Active

  • Pin Count:

    144

  • Manufacturer Package Code:

    LFBGA-144

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Technology:

    CMOS, 130 nm

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

A3P1000-FG144I Frequently Asked Questions (FAQs)

  • Microchip provides a PCB layout guide and stackup recommendations in their FPGA design guide, which can be found on their website. It's essential to follow these guidelines to ensure optimal signal integrity and minimize signal degradation.
  • A well-designed PDN is crucial for the FPGA's performance and reliability. Microchip recommends using a multi-layer PCB with a dedicated power plane, and following their guidelines for decoupling capacitors, voltage regulators, and power distribution. Additionally, using a PDN analyzer tool can help optimize the design.
  • Proper thermal management is essential to prevent overheating and ensure reliable operation. Microchip recommends using a heat sink or thermal interface material, and following their guidelines for thermal design and airflow management. It's also important to monitor the FPGA's temperature and adjust the design accordingly.
  • To ensure reliable and secure configuration and programming, it's essential to follow Microchip's guidelines for configuration and programming, including using a secure boot mechanism, encrypting the bitstream, and implementing secure authentication and authorization mechanisms.
  • To achieve high-speed signal integrity and minimize EMI, it's essential to follow Microchip's guidelines for signal integrity, including using differential signaling, controlling impedance, and minimizing signal reflections. Additionally, using EMI shielding and following good PCB design practices can help minimize EMI.

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A3P1000-FG144I Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image A3P1000-FG144YC Microsemi FPGA & SoC (now Microchip)

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Part Image A3P1000-FG144 Actel Corporation

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Part Image A3P1000-FG144T Actel Corporation

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For a full list of alternate parts for A3P1000-FG144I, check out Findchips.com