17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
HTS Code:
8542.31.00.60
Manufacturer:
Microsemi Corporation (now Microchip)
Clock Frequency-Max:
350 MHz
JESD-30 Code:
S-PBGA-B256
JESD-609 Code:
e1
Length:
17 mm
Moisture Sensitivity Level:
3
Number of CLBs:
9216
Number of Equivalent Gates:
400000
Number of Terminals:
256
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-40 °C
Organization:
9216 CLBS, 400000 GATES
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA256,16X16,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
250
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
1.8 mm
Supply Voltage-Max:
1.575 V
Supply Voltage-Min:
1.425 V
Supply Voltage-Nom:
1.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
17 mm
A3P400-FGG256I Frequently Asked Questions (FAQs)
Microsemi provides a PCB design guide for the A3P400-FGG256I, which recommends a 4-layer PCB with a specific stack-up and routing strategy to minimize signal integrity issues and ensure reliable operation.
The A3P400-FGG256I requires a 1.2V core voltage and 3.3V I/O voltage. A recommended power supply design includes a switching regulator for the core voltage and a linear regulator for the I/O voltage, with proper decoupling and filtering to minimize noise and ripple.
The A3P400-FGG256I has a maximum junction temperature of 100°C. To ensure reliable operation, a thermal management strategy should be implemented, including a heat sink, thermal interface material, and airflow management to keep the junction temperature below the maximum rating.
The A3P400-FGG256I can be configured using a variety of methods, including JTAG, SPI, and BPI. To ensure reliable configuration and programming, it is recommended to use a reliable configuration interface, such as a JTAG interface, and to follow the recommended configuration and programming procedures outlined in the datasheet and user manual.
The A3P400-FGG256I is designed to meet the requirements of various industries, including aerospace and defense. Radiation and environmental testing requirements vary depending on the specific application, but the FPGA is designed to meet the requirements of MIL-STD-883 and other relevant standards.
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A3P400-FGG256I Overview
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