17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
HTS Code:
8542.31.00.60
Manufacturer:
Microsemi Corporation (now Microchip)
Clock Frequency-Max:
350 MHz
JESD-30 Code:
S-PBGA-B256
JESD-609 Code:
e1
Length:
17 mm
Moisture Sensitivity Level:
3
Number of CLBs:
13824
Number of Equivalent Gates:
600000
Number of Terminals:
256
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-40 °C
Organization:
13824 CLBS, 600000 GATES
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA256,16X16,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
250
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
1.8 mm
Supply Voltage-Max:
1.575 V
Supply Voltage-Min:
1.425 V
Supply Voltage-Nom:
1.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
17 mm
A3P600-FGG256I Frequently Asked Questions (FAQs)
Microsemi provides a PCB design guide for the A3P600-FGG256I, which recommends a 4-layer PCB with a specific stack-up and routing strategy to minimize signal integrity issues and ensure reliable operation.
A well-designed PDN is critical for the A3P600-FGG256I. Engineers should follow Microsemi's guidelines for PDN design, including the use of decoupling capacitors, power planes, and careful routing of power and ground signals.
The A3P600-FGG256I has a maximum junction temperature of 100°C. Engineers should ensure good airflow, use thermal interfaces and heat sinks as needed, and follow Microsemi's thermal management guidelines to prevent overheating and ensure reliable operation.
Engineers should follow Microsemi's guidelines for clock domain crossing, clock tree synthesis, and clock signal routing to ensure reliable operation and minimize skew and jitter.
The A3P600-FGG256I has built-in security features such as secure boot, encryption, and authentication. Engineers should follow Microsemi's guidelines for secure design practices, including secure key management, secure data storage, and secure communication protocols.
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A3P600-FGG256I Overview
Use the download button to access the A3P600-FGG256I schematic symbol, PCB footprint, and 3D model.
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