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A3P600-PQ208I - Microsemi Corporation

Description: FPGA - Field Programmable Gate Array ProASIC3

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A3P600-PQ208I - Microsemi Corporation PCB footprint - Quad Flat Packages - Quad Flat Packages - 208 PQFP
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A3P600-PQ208I - Microsemi Corporation  - 3D model - Quad Flat Packages - 208 PQFP
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A3P600-PQ208I Details

  • Manufacturer Part Number:

    A3P600-PQ208I

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Clock Frequency-Max:

    350 MHz

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e0

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    13824

  • Number of Equivalent Gates:

    600000

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    13824 CLBS, 600000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    1.575 V

  • Supply Voltage-Min:

    1.425 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    28 mm

A3P600-PQ208I Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide that includes layout and routing guidelines for the A3P600-PQ208I. It's recommended to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Microsemi LX7167, which provides a reset signal to the FPGA during power-up. The POR circuit should be designed to ensure that the FPGA is held in reset until the power supply voltages are stable.
  • The A3P600-PQ208I has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. Microsemi provides thermal modeling and simulation tools to help with thermal design.
  • Microsemi provides a range of security features, including bitstream encryption, secure boot, and anti-tamper protection. Additionally, designers can implement their own security measures, such as secure key storage and access control, to protect their IP.
  • The A3P600-PQ208I is designed to be radiation-tolerant, but SEU mitigation strategies, such as triple modular redundancy (TMR) and error correction codes, should be implemented to ensure reliable operation in radiation-prone environments.

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A3P600-PQ208I Overview

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A3P600-PQ208I Alternates

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Part Image A3P600-PQ208Y Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 13824 CLBs, 600000 Gates, CMOS, PQFP208

Part Image A3P600-PQG208Y Microsemi FPGA & SoC (now Microchip)

Field Programmable Gate Array, 13824 CLBs, 600000 Gates, CMOS, PQFP208

Part Image A3P600-PQG208YI Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 13824 CLBs, 600000 Gates, CMOS, PQFP208

Part Image A3P600-PQ208I Microchip Technology Inc

Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 350MHz, CMOS, PQFP208

Part Image A3P600-PQG208YI Microchip Technology Inc

Field Programmable Gate Array, 13824 CLBs, 600000 Gates, CMOS, PQFP208

For a full list of alternate parts for A3P600-PQ208I, check out Findchips.com