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A3PE3000-FGG484I - Microsemi Corporation

Description: FPGA - Field Programmable Gate Array A3PE3000-FGG484I LEAD FREE

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A3PE3000-FGG484I - Microsemi Corporation PCB footprint - BGA - BGA - FG484
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A3PE3000-FGG484I - Microsemi Corporation  - 3D model - BGA - FG484
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A3PE3000-FGG484I Details

  • Manufacturer Part Number:

    A3PE3000-FGG484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Clock Frequency-Max:

    350 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    75264

  • Number of Equivalent Gates:

    3000000

  • Number of Inputs:

    341

  • Number of Logic Cells:

    75264

  • Number of Outputs:

    341

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    75264 CLBS, 3000000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.575 V

  • Supply Voltage-Min:

    1.425 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

A3PE3000-FGG484I Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide that includes layout and routing guidelines for the A3PE3000-FGG484I. It's recommended to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal to the FPGA. The FPGA's internal POR circuit can also be used in conjunction with an external voltage supervisor IC.
  • The A3PE3000-FGG484I has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. Microsemi provides thermal modeling and simulation tools to help with thermal design.
  • Microsemi provides a range of security features, including bitstream encryption, secure boot, and anti-tamper protection. Additionally, designers can implement their own security measures, such as secure key storage and access control, to protect their IP.
  • The A3PE3000-FGG484I is designed to withstand the harsh radiation environments found in space and aerospace applications. It features radiation-hardened-by-design (RHBD) architecture, which includes triple-mode redundancy, error correction, and single-event upset (SEU) mitigation. These features enable the FPGA to operate reliably in high-radiation environments.

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A3PE3000-FGG484I Overview

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Part Image A3PE3000-FG484I Microchip Technology Inc

Field Programmable Gate Array, 75264 CLBs, 3000000 Gates, 350MHz, 75264-Cell, CMOS, PBGA484

Part Image A3PE3000-FGG484I Microchip Technology Inc

Field Programmable Gate Array, 75264 CLBs, 3000000 Gates, 350MHz, 75264-Cell, CMOS, PBGA484

Part Image A3PE3000-FGG484I Actel Corporation

Field Programmable Gate Array, 75264 CLBs, 3000000 Gates, 350MHz, 75264-Cell, CMOS, PBGA484

Part Image A3PE3000-FG484I Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 75264 CLBs, 3000000 Gates, 350MHz, 75264-Cell, CMOS, PBGA484